Xiangxin DC60
Built for high heat-flux AI compute: 60kW per rack, PUE ≤ 1.05.
Prototype · Design targets
Overview
Phase-change cooling for your application.
Xiangxin DC60 combines a phase-change CDU, server-rack integration, chip microchannel cold plates and an intelligent O&M platform. It supports AI flow allocation, waterless cooling, hotspot removal and parallel scale-out.
Core capabilities
AI flow allocation
Dynamically allocates refrigerant flow across multi-node cold plates and parallel rack conditions.
Waterless cooling path
Uses dielectric refrigerant that vaporizes quickly during leakage, reducing short-circuit risk.
Hotspot removal
Chip microchannel cold plates use latent heat transfer to address local high heat-flux regions.
Intelligent O&M platform
Monitors temperature, pressure, flow and efficiency with anomaly alerts and remote O&M.
Specifications
Technical parameters
| Rated heat load | 60 kW / rack |
| PUE | ≤ 1.05 |
| Liquid-cooling efficiency comparison | 1.2-1.5 |
| Efficiency gain | 30 % vs. conventional liquid cooling |
Product gallery
Curious what phase-change direct cooling does in your operating envelope?
We bring the demo kit and the test rig to you — rebuilt for your scenario from cold plate up to rack-level CDU.